Mechanical and thermal stability of molecularly engineered Cu-silica interfaces using organosilane nanolayers

Mechanical and thermal stability of molecularly engineered Cu-silica interfaces using organosilane nanolayers

Gandhi, Darshan D.

Materials science and engineering

August 2007

School of Engineering

Rensselaer Polytechnic Institute, Troy, NY

Ramanath, G.

Schadler, L. S. (Linda S.)

Ozisik, Rahmi

Plawsky, Joel L., 1957-

Lane, M.

2007-08

Electronic thesis

ENG

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