Development of barrierless dielectrics and their integration with copper for nanodevice wiring

Development of barrierless dielectrics and their integration with copper for nanodevice wiring

Singh, Binay Kumar

Chemical engineering

May 2009

School of Engineering

Rensselaer Polytechnic Institute, Troy, NY

Ramanath, G.

Interrante, Leonard V., 1939-

Plawsky, Joel L., 1957-

Siegel, R. W. (Richard W.)

Lu, T. M. (Toh-Ming), 1943-

2009-05

Electronic thesis

ENG

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