Damascene patterned metal/adhesive wafer bonding for three-dimensional integration

Damascene patterned metal/adhesive wafer bonding for three-dimensional integration

McMahon, J. Jay

Electrical engineering

May 2008

School of Engineering

Center for Integrated Electronics

Rensselaer Polytechnic Institute, Troy, NY

Gutmann, Ronald J.

Lü, James

Bhat, Ishwara B.

Dutta, Partha S.

Nalamasu, Omkaram

2008-05

Electronic thesis

ENG

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