Study of thermal properties of packaged light-emitting diodes by transient junction temperature measurement

Study of thermal properties of packaged light-emitting diodes by transient junction temperature measurement

Shan, Qifeng

Physics

May 2009

School of Science

Rensselaer Polytechnic Institute, Troy, NY

Schubert, E. Fred

Kim, Jong Kyu

2009-05

Electronic thesis

ENG

This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.

Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries.