Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers

Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers

Lay, Nicole E.

Materials science and engineering

May 2006

School of Engineering

Rensselaer Polytechnic Institute, Troy, NY

Duquette, D. J.

Ramanath, G.

Shima, Mutsuhiro

Lu, T.-M. (Toh-Ming), 1943-

2006-05

Electronic thesis

ENG

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